Printing technology applied in the field of electronic engineering
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The high-precision molding process applied in the field of electronic engineering mostly uses the photolithography method in the actual production industry.
Table 1 is the minimum line width of the electronically-engineered components and optical components that have been commercialized. From the point of view of mass production processing methods, the photomask model must be photolithographically plated because of its nanoscale level, but 10μ. The above line width of the picture tube mask and the printed circuit board model are currently mass-produced using a photolithography process. The reason is that this method is highly reliable.
Despite this, due to the widespread use of optical components in the field of electronic engineering and the need to further reduce costs, processing is being replaced by other processes such as printing, inkjet, and electrophotography.
This is due to space limitations, and can only briefly introduce the high level of precision that can be achieved by the printing process, and some examples of its production and application.
Various ways of printing
Printing methods for printing text and images onto paper or film are divided into relief, lithography, gravure and stencil according to the shape of the layout, depending on the use. These common general printing techniques have evolved from analog to digital and then connected to the network to change appearance.
Here, let's focus on the strength of high-precision printing technology and its application in electronic engineering to analyze the current status of offset printing (lithographic) and screen printing (hole plate) (see Table 2). In general, it can be considered that the viscosity of the ink is relatively high, and the thickness of the reproduction film is relatively thin, and the fine line reproducibility seems to be better.
As an example of the most popular offset printing, overseas magazines have used the 700-line printing case on the color cover of the weekly magazine. Usually printed with 175 lines, and suddenly decided to use 700 lines to print, the performance of the fine parts will of course increase. An image that is invisible to the naked eye can be clearly recognized by a magnifying glass. Because it is a dot, although the fine line width is difficult to express, it can still show a degree of 20μ. However, this is just an illustration of the printed image. When it comes to the model reproduction of electronic engineering applications, the requirements are much stricter. This is mainly due to the lack of ink film thickness.
In addition, as an example of gravure printing, for the fine text and fine shading printed on the anti-counterfeiting of stocks, securities, etc., if you look at this part of the image with a magnifying glass, you can see the reproduction of 10~20μ thin lines. . In general, gravure printing is advantageous for electronic engineering applications because it can enhance the thickness of the ink film compared to offset printing.
Printing LCD enamel mirrors with gravure offset printing
Here is an example of printing an LCD enamel mirror with gravure offset printing. After the ink is applied to the intaglio plate, after transfer onto the silicon blanket,The method of printing the full amount onto the glass substrate (see Figure 1). At the time of mass production, according to the design size, the printed line width was 40 to 50 μ color mirror is on the market. However, the problem left is the flatness of the surface of the model.
As a method of improving flatness, a flip printing method has been developed. This is done by first applying the ink directly onto the blanket, removing the unwanted portion with a negative relief, and finally transferring it to a plain glass plate. The flatness of the model is completely dependent on the uniformity and smoothness of the ink layer applied to the blanket. Therefore, it can be said that this method is easier to control the flatness than the gravure offset printing method.