Printing technology for applications in the field of electronic engineering (continued)
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The strength of screen printing
As an example of the ability to represent the strength of screen printing, a reproduction template using a fine mesh version of stainless steel and printing with a silver paste on a glass plate is introduced.
From the appearance, L/S = 20 μ / 20 μ reproduction. However, the physical properties required for electrical characteristics, etc., should be evaluated. This depends on the product specifications of the target and the physical properties of the inks and slurries used. The resulting fine limit values will vary. The cooperation with the built-in circuit board of the component With the evolution of the mobile terminal, the slimness of the device LSI module assembled therein has also progressed. The receiving member such as the resistor (R), the capacitor (C), and the inductor (L), which is an important part thereof, is being studied to be changed from the case of being mounted externally to the interior. The R, C, and L components are assembled in a process of forming a laminated circuit board using a thickening process. There are two ways to do this. One is to fill the pre-prepared microchip components into the built-in circuit board as a method of connecting the wiring. The other is an ink which is formed into a slurry by using a conductor material, a resistor material, a dielectric material, a magnetic material, or the like, and is laminated by screen printing or the like, and buried together with the wiring. In some cases, a film or the like is used in the dielectric layer and the magnetic layer.
Whether or not the components that are printed by the actual electrical properties are actually in the performance of the paste ink. The materials that can be applied to the above materials are limited. In order to make ink, it is necessary to develop inorganic and organic resins of nano-synthesis. In fact, these parts made of printing are supplied to the range of available products, and are limited to only a part of the situation, which is the status quo. Another example of the closest application is to test the printing method with the goal of reducing the cost of antenna forming projects for non-contact IC cards and RFID tags.
Regardless of the application example, it is generally accepted that parts made by printing methods are widely used, and it is hoped that materials and processes will be further developed in the future.
Challenge to printed transistors
Recently, research and development on the production of organic semiconductors and organic EL devices has been very active. It's still only the research stage, not to mention that all the process of making the device, entirely through printing, can be considered a new challenge.
The basic structure of the (TFT) of the thin film transistor is composed of four layers. The thickness of the semiconductor layer should be ultra-fine level, the source-drain electrode should be accurately positioned, and the channel isolation between the two should be 5μ. The valve insulation film should be as thin as possible, should be ultra-fine level, and the valve electrode must not deviate from the channel ( Source – between drain electrodes).
In order to highlight the performance of the TFT, the control of the distance between the source-drain electrodes (channel width) is extremely important for the thickness of the semiconductor layer and the insulating film layer. The fabrication of organic transistors is almost entirely a photolithography process. Therefore, its practical performance is not enough, and it is in the stage of research and trial production. This is due to the constraints on the materials of the layers and the limitations of the above process, as well as the poor performance of the silicon transistors.
What's more, if you want to use the production process of organic transistors to achieve the lowest cost, all the attempts to do by printing, the threshold is even higher. When the layers are superimposed by the printing method, the above-mentioned film thickness control and channel isolation control are quite difficult in comparison with photolithography in terms of the accuracy of the molding (see Table 4).
Compared with the receiving components of R, C, L, etc. mentioned above, the difficulty in fabricating an active component such as a transistor is not only the accuracy of modeling. That is because of the electrical characteristics of the semiconductor layer, that is, to improve the mobility of electrons and holes. Just using a semiconductor ink to transfer it is not enough. The work to be done on it is to study the method of improving the mobility when transferring the ink or after transferring the ink, and what method is used to make the semiconductor material wait for orientation. Calling this a process called "self-organizing film" has become a research topic. It will take time to reach a practical level, and we are expecting the results of its research to come out soon.
Conclusion
I have talked about a number of examples and I have seen the high-definition technology brand that is now practical. To sum up, as shown in (Table 5), the reproduction of various printing layouts and their minimum line width. As already mentioned, the minimum line width varies depending on the application. This table shows the most common values for image reproduction. Especially in the field of electronic engineering applications, the actual fineness is lower than that shown in the table according to the characteristics and accuracy standards required for various target products.
However, the trend of low cost, large area, and flexibility of electronic engineering products will continue to progress in the future. With this demand, expectations for the printing process will also increase. As long as the development of ink materials is used conditionally, the advancement of interface property control technology, etc., will greatly hope that the printing art will make greater contributions in the field of electronic engineering applications.